CAS OpenIR  > 研究所(批量导入)
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
张晓瑞; 汪春雷; 赵宏欣; 李建强; 袁章福
2009
Source Publication过程工程学报
Issue04Pages:829-832
Abstract采用静滴法对Sn-Zn,Sn-Ag-Cu,Sn-Bi-Cu锡基合金在铜基板上的润湿性进行了研究.结果表明,Sn-Bi-Cu合金的润湿性良好,Sn-30Bi-0.5Cu合金在530K时的接触角为26o,熔融的Sn-3Ag-0.5Cu共晶合金的接触角几乎不存在滞后性.锡基合金中添加Bi元素可提高合金的润湿性,添加Cu元素可有效防止溶铜发生.研究结果为无铅焊锡合金的应用提供了一定的理论依据.
Keyword无铅焊料 润湿性 接触角 滞后性 界面层
Indexed ByCSCD
CSCD IDCSCD:3659335
Citation statistics
Cited Times:4[CSCD]   [CSCD Record]
Document Type期刊论文
Identifierhttp://ir.ipe.ac.cn/handle/122111/10779
Collection研究所(批量导入)
Recommended Citation
GB/T 7714
张晓瑞,汪春雷,赵宏欣,等. Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性[J]. 过程工程学报,2009(04):829-832.
APA 张晓瑞,汪春雷,赵宏欣,李建强,&袁章福.(2009).Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性.过程工程学报(04),829-832.
MLA 张晓瑞,et al."Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性".过程工程学报 .04(2009):829-832.
Files in This Item:
File Name/Size DocType Version Access License
Sn_Zn_Sn_Ag_Cu和S_省略_(1160KB)期刊论文出版稿限制开放CC BY-NC-SAApplication Full Text
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[张晓瑞]'s Articles
[汪春雷]'s Articles
[赵宏欣]'s Articles
Baidu academic
Similar articles in Baidu academic
[张晓瑞]'s Articles
[汪春雷]'s Articles
[赵宏欣]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[张晓瑞]'s Articles
[汪春雷]'s Articles
[赵宏欣]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.