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Separation of Copper Foils and Base Plates from Waste Printed Circuit Boards by Chemical Swelling Method
Cao, H. B.; Zhang, X. H.; Liu, H. L.
2010
Conference Name5th International Conference on Waste Management and Technology
Source PublicationSELECTED PROCEEDINGS OF THE FIFTH INTERNATIONAL CONFERENCE ON WASTE MANAGEMENT AND TECHNOLOGY(ICWMT 5) 页: 309-313
Pages309-313
Conference DateDEC 15-17, 2010
Conference PlaceBeijing, PEOPLES R CHINA
PublisherSci Res Publ, Inc-Srp
AbstractIn this paper, ten kinds of chemical solvents were used to immerse the waste printed circuit boards (PCBs). Comparing the effects of chemical swelling solvents on the peeling strength between copper foils and base plates from PCBs, solvent D, solvent F, acetone and water were selected as the typical chemical swelling solvents. After chemical swelling treatment, the monomer liberation degree and scrapping time were further investigated to obtain particles with certain size distribution. The experimental results showed that scrapping after chemical swelling treatment could remarkably increase the monomer liberation degree of metals. The chemical swelling effects of the four solvents were in the sequence solvent D > solvent F > acetone > water. The longer time and higher temperature favored the decrease of peeling strength between copper foils and base plates from PCBs. The copper foils could fall off from the base plates spontaneously after immersing in solvent D at 150 degrees C for 3 h or at 140 degrees C for 5 h. This study demonstrated that chemical swelling treatment was very conductive to achieve higher monomer liberation degree of metals with coarser particle sizes.
KeywordWaste Printed Circuit Boards Chemical Swelling Peeling Strength Monomer Liberation Degree Electronic Scrap Recovery Equipment Metals
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Indexed ByISTP
Language英语
Document Type会议论文
Identifierhttp://ir.ipe.ac.cn/handle/122111/11071
Collection研究所(批量导入)
Recommended Citation
GB/T 7714
Cao, H. B.,Zhang, X. H.,Liu, H. L.. Separation of Copper Foils and Base Plates from Waste Printed Circuit Boards by Chemical Swelling Method[C]:Sci Res Publ, Inc-Srp,2010:309-313.
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