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Controlled Electrodeposition of Uniform Copper Powder from Hydrochloric Acid Solutions
Jin, Wei1; Su, Junling1; Zheng, Shili1; Lei, Hong2
2017
Source PublicationJOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN0013-4651
Volume164Issue:12Pages:D723-D728
Abstract

Recovery of copper from hydrochloric acid solution is of significant importance for the heavy-metal pollution protection and valuable metal resources utilization. In order to overcome the drawbacks of low current efficiency and contaminated deposits in conventional electrochemical recovery, a controlled electrodeposition process was first developed using low-cost stainless steel cathodes. It has been demonstrated that mass transport has a facilitating effect for the copper electrodeposition in HCl media, thus a cylinder turbulent cell equipped larger surface area cathode was used. 93.6% copper was successfully extracted with a current efficiency of 89.4%, and the impurity of CuCl was completely eliminated. This indicated the low efficiency chloride-mediated pathway was avoided and the regular 2e reduction to metallic copper was greatly improved. Besides, more uniform and fine powder was obtained, which could be readily flushed and collected from the cell with water. This controlled electrodeposition may serve as a promising alternative to overcome the disadvantages of existing metal recovery and water purification. (C) 2017 The Electrochemical Society. All rights reserved.

KeywordWaste-water Recovery Sulfate Effluents Removal Alloys Scale Cell
SubtypeArticle
WOS HeadingsScience & Technology ; Physical Sciences ; Technology
DOI10.1149/2.1491712jes
Indexed BySCI
Language英语
WOS KeywordWaste-water ; Recovery ; Sulfate ; Effluents ; Removal ; Alloys ; Scale ; Cell
WOS Research AreaElectrochemistry ; Materials Science
WOS SubjectElectrochemistry ; Materials Science, Coatings & Films
Funding OrganizationNational Natural Science Foundation of China(51604253
WOS IDWOS:000415283600112
Citation statistics
Cited Times:5[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.ipe.ac.cn/handle/122111/23540
Collection研究所(批量导入)
Corresponding AuthorJin, Wei
Affiliation1.Chinese Acad Sci, Inst Proc Engn, Natl Engn Lab Hydromet Cleaner Prod Technol, Beijing 100190, Peoples R China
2.Northeastern Univ, Minist Educ, Key Lab Electromagnet Proc Mat, Shenyang 110819, Liaoning, Peoples R China
Recommended Citation
GB/T 7714
Jin, Wei,Su, Junling,Zheng, Shili,et al. Controlled Electrodeposition of Uniform Copper Powder from Hydrochloric Acid Solutions[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2017,164(12):D723-D728.
APA Jin, Wei,Su, Junling,Zheng, Shili,&Lei, Hong.(2017).Controlled Electrodeposition of Uniform Copper Powder from Hydrochloric Acid Solutions.JOURNAL OF THE ELECTROCHEMICAL SOCIETY,164(12),D723-D728.
MLA Jin, Wei,et al."Controlled Electrodeposition of Uniform Copper Powder from Hydrochloric Acid Solutions".JOURNAL OF THE ELECTROCHEMICAL SOCIETY 164.12(2017):D723-D728.
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