CAS OpenIR
Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites
Xue, Yang1,2; Li, Xiaofei1,2; Wang, Haosheng2; Zhao, Feng1,2; Zhang, Donghai2; Chen, Yunfa2,3
2019-03-05
Source PublicationMATERIALS & DESIGN
ISSN0264-1275
Volume165Pages:8
AbstractEffective heat dissipation has become a critical issue for electronic devices. In this study, the silicone rubber (SR)/vertically aligned boron nitride (BN) composites were prepared and the thermal conductivity of the composites was systematically investigated. The vertically aligned BNs constructed effective vertical thermal conductive pathways in the SR matrix, and the SR/ABN composites exhibited much higher through-plane thermal conductivity compared to the non-orientated SR/BN composite. The through-plane thermal conductivity of SR/ABN150 reached 5.4 W m(-1) K-1, which was similar to 6.3 and similar to 33 times higher than those of SR/BN150 and pure SR, respectively. In addition, the surface thermal infrared analysis also indicates that the vertically aligned SR/ABN composites possess excellent heat transfer capacity during the heating and cooling processes. The obtained results exhibit the potential for the design and preparation of thermal interface materials (TIMs) with high through-plane thermal conductivity to be applied in thermal conductive and electrical insulating field. (C) 2019 Elsevier Ltd.
KeywordVertically aligned-BN Through-plane thermal conductivity SR composites Interface thermal resistance Mechanical orientation
DOI10.1016/j.matdes.2018.107580
Language英语
WOS KeywordPOLYMER-BASED COMPOSITES ; NITRIDE NANOSHEETS ; COLD-PLASMA ; ENHANCEMENT ; BN ; NANOCOMPOSITES ; FABRICATION ; FILLERS ; FOAM
Funding ProjectNational Key R&D Program of China[2016YFC0204600] ; Strategic Priority Research Program of the Chinese Academy of Sciences[XDA09030202]
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
Funding OrganizationNational Key R&D Program of China ; Strategic Priority Research Program of the Chinese Academy of Sciences
WOS IDWOS:000458259300010
PublisherELSEVIER SCI LTD
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.ipe.ac.cn/handle/122111/27898
Collection中国科学院过程工程研究所
Corresponding AuthorChen, Yunfa
Affiliation1.Univ Chinese Acad Sci, Beijing 100049, Peoples R China
2.Chinese Acad Sci, Inst Proc Engn, China State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China
3.Chinese Acad Sci, Inst Urban Environm, Ctr Excellence Reg Atmospher Environm, Xiamen 361021, Peoples R China
Recommended Citation
GB/T 7714
Xue, Yang,Li, Xiaofei,Wang, Haosheng,et al. Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites[J]. MATERIALS & DESIGN,2019,165:8.
APA Xue, Yang,Li, Xiaofei,Wang, Haosheng,Zhao, Feng,Zhang, Donghai,&Chen, Yunfa.(2019).Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites.MATERIALS & DESIGN,165,8.
MLA Xue, Yang,et al."Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites".MATERIALS & DESIGN 165(2019):8.
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