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Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders
Sun, Hong1,2; Guo, Lijiang1; Deng, Nan1,3; Li, Xiaoyu1; Li, Jiangtao4; He, Gang4; Li, Jianqiang1,2
2019-11-25
Source PublicationJOURNAL OF ALLOYS AND COMPOUNDS
ISSN0925-8388
Volume810Pages:7
AbstractActuated by the needs of high power electronic devices heat dissipation, diamond/Cu composites with excellent thermal dissipation properties have been considered as the next generation of thermal management material. Herein, an easy-to-operate intermittently electroplated method is developed for coating micro-sized particles and successfully applied to prepare Cu-coated diamond powders for the first time. The Cu coating is covered evenly and densely on the diamond particles surface, and its volume fraction in diamond/Cu composite powders could be precisely controlled by adjusting the plating time. The dense diamond/Cu composites bulks with varied Cu volume fractions were obtained by hot-press sintering process. The as-sintered microstructures of diamond/Cu bulks present that diamond particles are bonded strongly by Cu shell layer, which is conducive to promoting densification capacity. The maximal diamond/Cu composite bulk possesses high thermal conductivity of 638 W/(m.K) and low coefficient of thermal expansion (CTE) of 4.11 x 10(-6)/K at 55 vol% diamond. The bending strength of 45 vol% diamond/Cu composite reaches 276 MPa. The combination of these excellent thermal and mechanical properties, coupled with the simple, efficient powder-preparation process, demonstrate the large potential of intermittently electroplated method applying in the development of thermal management material. (C) 2019 Elsevier B.V. All rights reserved.
KeywordMetal matrix composites Electroplating Sintering Thermal conductivity
DOI10.1016/j.jallcom.2019.151907
Language英语
WOS KeywordMETAL-MATRIX COMPOSITES ; COPPER/DIAMOND COMPOSITES ; CU/DIAMOND COMPOSITES ; INTERFACIAL DESIGN ; LAYER ; INFILTRATION ; OPTIMIZATION ; MANAGEMENT ; MICROSTRUCTURE ; PRETREATMENT
Funding ProjectStrategic Priority Research Program of the Chinese Academy of Sciences[XDA15013500] ; National Natural Science Foundation of China[51501179]
WOS Research AreaChemistry ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectChemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
Funding OrganizationStrategic Priority Research Program of the Chinese Academy of Sciences ; National Natural Science Foundation of China
WOS IDWOS:000486596000071
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.ipe.ac.cn/handle/122111/31014
Collection中国科学院过程工程研究所
Corresponding AuthorLi, Jianqiang
Affiliation1.Chinese Acad Sci, Inst Proc Engn, CAS Key Lab Green Proc & Engn, Natl Engn Lab Hydromet Cleaner Prod Technol, Beijing 100190, Peoples R China
2.Univ Chinese Acad Sci, Beijing 100049, Peoples R China
3.Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China
4.Chinese Acad Sci, Tech Inst Phys & Chem, Beijing 100190, Peoples R China
Recommended Citation
GB/T 7714
Sun, Hong,Guo, Lijiang,Deng, Nan,et al. Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2019,810:7.
APA Sun, Hong.,Guo, Lijiang.,Deng, Nan.,Li, Xiaoyu.,Li, Jiangtao.,...&Li, Jianqiang.(2019).Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders.JOURNAL OF ALLOYS AND COMPOUNDS,810,7.
MLA Sun, Hong,et al."Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders".JOURNAL OF ALLOYS AND COMPOUNDS 810(2019):7.
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