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Thermal conductivity of powder silica hollow spheres
Liao, Yuchao1,2; Wu, Xiaofeng1; Liu, Haidi1; Chen, Yunfa1; Chen, YF
2011-11-10
Source PublicationTHERMOCHIMICA ACTA
ISSN0040-6031
Volume526Issue:1-2Pages:178-184
AbstractThe thermophysical property of hollow silica spheres was studied by the experimental test 3 omega method, theoretical calculation and finite element simulation. The experimental values of the thermal conductivity, less than 0.02 Wm(-1) K-1, indicated that the powder silica hollow spheres are indeed the high efficient heat-insulating materials. The influences of the particle size and packing density on the thermal conductivity were observed. Then the formula interpreting aerogels were used to calculate the thermal conductivity of hollow silica spheres. The calculated values were larger than the experimental ones. Moreover, ANSYS software was applied to develop a heat conduction model for this type materials based on their hollow structure features. The geometry of the materials was discrete and finite element analysis was performed. The simulated values were close to that of air and a little higher than the experimental and calculated ones. And the possible reasons causing such differences were proposed. (C) 2011 Elsevier B.V. All rights reserved.
KeywordNumerical Analysis Thermal Conductivity Powder Silica Hollow Spheres Finite Element Analysis
SubtypeArticle
WOS HeadingsScience & Technology ; Physical Sciences
DOI10.1016/j.tca.2011.09.011
Indexed BySCI
Language英语
WOS KeywordORGANIC AEROGELS ; FINITE-ELEMENT ; HEAT-TRANSFER
WOS Research AreaChemistry
WOS SubjectChemistry, Analytical ; Chemistry, Physical
WOS IDWOS:000298274300026
Citation statistics
Document Type期刊论文
Version出版稿
Identifierhttp://ir.ipe.ac.cn/handle/122111/4337
Collection多相复杂系统国家重点实验室
Corresponding AuthorChen, YF
Affiliation1.Chinese Acad Sci, Inst Proc Engn, State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China
2.Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R China
Recommended Citation
GB/T 7714
Liao, Yuchao,Wu, Xiaofeng,Liu, Haidi,et al. Thermal conductivity of powder silica hollow spheres[J]. THERMOCHIMICA ACTA,2011,526(1-2):178-184.
APA Liao, Yuchao,Wu, Xiaofeng,Liu, Haidi,Chen, Yunfa,&Chen, YF.(2011).Thermal conductivity of powder silica hollow spheres.THERMOCHIMICA ACTA,526(1-2),178-184.
MLA Liao, Yuchao,et al."Thermal conductivity of powder silica hollow spheres".THERMOCHIMICA ACTA 526.1-2(2011):178-184.
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