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Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates
Xu, Hongyan1,2,3; Yuan, Zhangfu1,2; Lee, Joonho4; Matsuura, Hiroyuki5; Tsukihashi, Fumitaka5; Yuan, ZF
2010-04-20
Source PublicationCOLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
ISSN0927-7757
Volume359Issue:1-3Pages:1-5
AbstractThe contour evolution and sliding behavior of molten Sn-3.0 wt.%Ag-0.5 wt.%Cu on tilting Cu and Al2O3 substrates were investigated. Experiments were performed to determine how the upper and lower contact angles and the sliding behavior changed with tilted angle of surface, kind of substrates and temperature. When the molten drop, as a whole, slid down the tilting solid surface, the upper and lower contact angles measured were defined as the advancing angle and receding angle, respectively. In general, the contour evolution of sample on Cu substrate experienced three periods and each period had different steps with the increase of the temperature compared to the only two periods on Al2O3, which could explain articulately the spreading and wetting behavior for sample on tilting Cu substrate. The reactive layer near receding contact point was thicker than that near advancing contact point as the molten drop slid, because that the former had longer contact time with substrate than the latter. The sliding behavior on Al2O3 was not the same as that on Cu accompanied which the base profile deformed. (C) 2010 Elsevier B.V. All rights reserved.
KeywordContour Evolution Contact Angle Sliding Behavior Tilting Substrate Interaction
SubtypeReview
WOS HeadingsScience & Technology ; Physical Sciences
DOI10.1016/j.colsurfa.2010.01.060
Indexed BySCI
Language英语
WOS KeywordCONTACT-ANGLE HYSTERESIS ; HYDROPHOBIC SURFACES ; SOLDERING MATERIALS ; TILTED PLATE ; LIQUID-DROPS ; WETTABILITY ; DROPLETS ; ALLOYS
WOS Research AreaChemistry
WOS SubjectChemistry, Physical
WOS IDWOS:000276599900001
Citation statistics
Cited Times:10[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Version出版稿
Identifierhttp://ir.ipe.ac.cn/handle/122111/6167
Collection多相复杂系统国家重点实验室
Corresponding AuthorYuan, ZF
Affiliation1.Peking Univ, Dept Energy & Resources Engn, Coll Engn, Beijing 100871, Peoples R China
2.Chinese Acad Sci, Inst Proc Engn, State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China
3.Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R China
4.Korea Univ, Dept Mat Sci & Engn, Seoul 136713, South Korea
5.Univ Tokyo, Dept Adv Mat Sci, Grad Sch Frontier Sci, Chiba 2778561, Japan
Recommended Citation
GB/T 7714
Xu, Hongyan,Yuan, Zhangfu,Lee, Joonho,et al. Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates[J]. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS,2010,359(1-3):1-5.
APA Xu, Hongyan,Yuan, Zhangfu,Lee, Joonho,Matsuura, Hiroyuki,Tsukihashi, Fumitaka,&Yuan, ZF.(2010).Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates.COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS,359(1-3),1-5.
MLA Xu, Hongyan,et al."Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates".COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS 359.1-3(2010):1-5.
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