CAS OpenIR  > 研究所(批量导入)
Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate
Alternative TitleChin. Sci. Bull.
Zhang XiaoRui1,2; Yuan ZhangFu1,2; Zhao HongXin2; Zang LiKun2; Li JianQiang2
2010-03-01
Source PublicationCHINESE SCIENCE BULLETIN
ISSN1001-6538
Volume55Issue:9Pages:797-801
AbstractWettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy's melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample's cross section. Intermetallic compounds of Cu(6)Sn(5) and beta-Sn phase were found at the interface of Sn-Ag-Cu/Cu.; Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy's melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample's cross section. Intermetallic compounds of Cu(6)Sn(5) and beta-Sn phase were found at the interface of Sn-Ag-Cu/Cu.
KeywordContact Angle Lead-free Solder Sessile Drop Method Sn-ag-cu Intermetallic Compounds
SubtypeArticle
WOS HeadingsScience & Technology
DOI10.1007/s11434-010-0056-z
URL查看原文
Indexed BySCI
Language英语
WOS KeywordLEAD-FREE SOLDERS ; SESSILE DROP METHOD ; SURFACE-TENSION ; INTERMETALLIC COMPOUNDS ; BI SOLDER ; CREEP
WOS Research AreaScience & Technology - Other Topics
WOS SubjectMultidisciplinary Sciences
WOS IDWOS:000275821800003
Citation statistics
Cited Times:16[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Version出版稿
Identifierhttp://ir.ipe.ac.cn/handle/122111/6523
Collection研究所(批量导入)
Affiliation1.Peking Univ, Coll Engn, Dept Energy & Resources Engn, Beijing 100871, Peoples R China
2.Chinese Acad Sci, Inst Proc Engn, State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China
Recommended Citation
GB/T 7714
Zhang XiaoRui,Yuan ZhangFu,Zhao HongXin,et al. Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate[J]. CHINESE SCIENCE BULLETIN,2010,55(9):797-801.
APA Zhang XiaoRui,Yuan ZhangFu,Zhao HongXin,Zang LiKun,&Li JianQiang.(2010).Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate.CHINESE SCIENCE BULLETIN,55(9),797-801.
MLA Zhang XiaoRui,et al."Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate".CHINESE SCIENCE BULLETIN 55.9(2010):797-801.
Files in This Item:
File Name/Size DocType Version Access License
Wetting behavior and(927KB) 限制开放CC BY-NC-SAApplication Full Text
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Zhang XiaoRui]'s Articles
[Yuan ZhangFu]'s Articles
[Zhao HongXin]'s Articles
Baidu academic
Similar articles in Baidu academic
[Zhang XiaoRui]'s Articles
[Yuan ZhangFu]'s Articles
[Zhao HongXin]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Zhang XiaoRui]'s Articles
[Yuan ZhangFu]'s Articles
[Zhao HongXin]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.