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Wettability of molten Sn-Bi-Cu solder on Cu substrate
Zang, Likun1,2,4; Yuan, Zhangfu2,3; Zhao, Hongxin2,4; Zhang, Xiaorui4; Zang, LK
2009-09-30
Source PublicationMATERIALS LETTERS
ISSN0167-577X
Volume63Issue:23Pages:2067-2069
AbstractThe wetting behavior of a new Sn-Bi-Cu Pb-firee solder on Cu substrate was investigated by sessile drop method under an Ar-H(2) flow in the temperature range from 493 K to 623 K. The contact angle curves tested at 548 K and 623 K are found to fit exponential rule very well. However. the contact angle curve tested under493 K is not well consistent with exponential rule, for which the spreading course may be classified into three stages. Equilibrium contact angles between Sn-Bi-Cu solder and Cu substrate decrease monotonously with the increase in temperature, which are 28 degrees, 24 degrees and 18 degrees at 493 K. 548 K and 623 K, respectively. The results show that 69.5Sn30Bi-0.5Cu/exhibits good wettability on Cu substrate. Intermetallics formed at the 69.5Sn-30Bi-0.5Cu/Cu interface are identified as Cu(6)Sn(5) adjacent to the solder and Cu(3)Sn adjacent to the Cu substrate, respectively. Formation of intermetallic seems to improve strong wetting of the substrate by the solder. (C) 2009 Elsevier B.V. All rights reserved.
KeywordElectronic Materials Metals And Alloys Intermetallic Compound Wettability
SubtypeArticle
WOS HeadingsScience & Technology ; Technology ; Physical Sciences
DOI10.1016/j.matlet.2009.06.052
Indexed BySCI
Language英语
WOS KeywordLEAD-FREE SOLDERS ; INTERFACIAL REACTIONS ; SURFACE-TENSION ; TEMPERATURE-COEFFICIENT ; ALLOY ; ZN ; AG
WOS Research AreaMaterials Science ; Physics
WOS SubjectMaterials Science, Multidisciplinary ; Physics, Applied
WOS IDWOS:000269174900029
Citation statistics
Cited Times:32[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Version出版稿
Identifierhttp://ir.ipe.ac.cn/handle/122111/6580
Collection多相复杂系统国家重点实验室
Corresponding AuthorZang, LK
Affiliation1.Univ Sci & Technol Beijing, Sch Appl Sci, Beijing 100083, Peoples R China
2.Chinese Acad Sci, State Key Lab Multiphase Complex Syst, Inst Proc Engn, Beijing 100190, Peoples R China
3.Peking Univ, Coll Engn, Dept Energy & Resources Engn, Beijing 100871, Peoples R China
4.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
Recommended Citation
GB/T 7714
Zang, Likun,Yuan, Zhangfu,Zhao, Hongxin,et al. Wettability of molten Sn-Bi-Cu solder on Cu substrate[J]. MATERIALS LETTERS,2009,63(23):2067-2069.
APA Zang, Likun,Yuan, Zhangfu,Zhao, Hongxin,Zhang, Xiaorui,&Zang, LK.(2009).Wettability of molten Sn-Bi-Cu solder on Cu substrate.MATERIALS LETTERS,63(23),2067-2069.
MLA Zang, Likun,et al."Wettability of molten Sn-Bi-Cu solder on Cu substrate".MATERIALS LETTERS 63.23(2009):2067-2069.
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