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电镀包埋制备可减薄粉末样品的研究
韩勇; 李钒; 熊明; 吴秀玲; 方勤方
2002
Source Publication电子显微学报
Issue05Pages:802-803
Keyword可减薄粉末:7125 表面活性剂:5982 国家专业实验室:2053 矿物材料:1627 粉末颗粒:1480 聚乙二醇:1012 中国地质大学:973 离子减薄:971 阳极溶解:878 石榴子石:828
Document Type期刊论文
Version出版稿
Identifierhttp://ir.ipe.ac.cn/handle/122111/6829
Collection研究所(批量导入)
Recommended Citation
GB/T 7714
韩勇,李钒,熊明,等. 电镀包埋制备可减薄粉末样品的研究[J]. 电子显微学报,2002(05):802-803.
APA 韩勇,李钒,熊明,吴秀玲,&方勤方.(2002).电镀包埋制备可减薄粉末样品的研究.电子显微学报(05),802-803.
MLA 韩勇,et al."电镀包埋制备可减薄粉末样品的研究".电子显微学报 .05(2002):802-803.
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