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镍包石墨(Ni/C)微颗粒镍镀层的均匀性
陈烨; 刘伟; 杜令忠; 张伟刚
2009
Source Publication过程工程学报
Issue02Pages:293-299
Abstract采用湿式加压氢还原法制备球形Ni/C微颗粒,着重考察了核心颗粒的粒度分散性及氢气传质过程对石墨颗粒表面镍沉积层均匀性的影响.结果表明,球形石墨颗粒粒径从30μm增加到60μm左右,对应的镍镀层厚度从4.5μm增加至6.0μm左右,减小核心颗粒的粒度分散性可以减小镀层厚度的差异,提高包覆均匀性;双叶轮搅拌速率在500~1000r/min范围内有效强化了氢气在体系中的传质,得到的Ni/C颗粒镀覆均匀性明显改善,搅拌效果优于单叶轮.
KeywordNi/c复合材料 颗粒包覆 镀层均匀性
Indexed ByCSCD
CSCD IDCSCD:3587868
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Document Type期刊论文
Identifierhttp://ir.ipe.ac.cn/handle/122111/9774
Collection研究所(批量导入)
Recommended Citation
GB/T 7714
陈烨,刘伟,杜令忠,等. 镍包石墨(Ni/C)微颗粒镍镀层的均匀性[J]. 过程工程学报,2009(02):293-299.
APA 陈烨,刘伟,杜令忠,&张伟刚.(2009).镍包石墨(Ni/C)微颗粒镍镀层的均匀性.过程工程学报(02),293-299.
MLA 陈烨,et al."镍包石墨(Ni/C)微颗粒镍镀层的均匀性".过程工程学报 .02(2009):293-299.
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