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含季铵荷电基团的有机-无机杂化介孔材料的合成与表征
黄瑞强; 苏仪; 万印华; 马润宇
2010
Source Publication化工新型材料
IssueS1Pages:49-52+75
Abstract以十二烷基硫酸钠(SDS)为模板剂,正硅酸乙酯(TEOS)和N-三甲氧基硅丙基-N,N,N-三甲基氯化铵(TSPMNC)为硅源,以NaOH为催化剂,合成出带有季铵荷正电基团的有序介孔材料(QAS)。采用XRD,TGA、BET、SEM,XPS、TEM、FT-IR等手段对产品结构进行了表征和分析。结果表明,产品具有较为均一的六方介孔结构,孔径约为3.5nm,产品中季铵荷电基团的含量约为1.41mmol/g。
Keyword介孔材料 季铵化改性 有机-无机杂化材料
Indexed ByCSCD
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Document Type期刊论文
Identifierhttp://ir.ipe.ac.cn/handle/122111/9975
Collection研究所(批量导入)
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GB/T 7714
黄瑞强,苏仪,万印华,等. 含季铵荷电基团的有机-无机杂化介孔材料的合成与表征[J]. 化工新型材料,2010(S1):49-52+75.
APA 黄瑞强,苏仪,万印华,&马润宇.(2010).含季铵荷电基团的有机-无机杂化介孔材料的合成与表征.化工新型材料(S1),49-52+75.
MLA 黄瑞强,et al."含季铵荷电基团的有机-无机杂化介孔材料的合成与表征".化工新型材料 .S1(2010):49-52+75.
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